Intel's Foundry division is on the verge of multibillion-dollar annual deals for its EMIB and Foveros packaging tech, as confirmed by CFO David Zinsner. CEO Lip-Bu Tan has also reversed plans, offering the cutting-edge 18A process to external customers amid surging AI demand.
Intel's CFO reveals the company is nearing multi-billion-dollar annual deals for its cutting-edge packaging tech, fueled by AI demand. The firm may also open its competitive 18A process to external customers.
Intel's CFO revealed the company is on the verge of sealing annual deals worth billions for its cutting-edge packaging tech, fueled by surging AI demand. The 18A process could soon welcome external customers as Intel eyes leadership against TSMC.
Intel's CFO revealed the company is on the verge of securing annual multi-billion-dollar contracts for its advanced EMIB packaging technology, driven by surging AI demand. CEO Lip-Bu Tan now backs offering the 18A process to external customers following strong interest.
Nvidia is auditing Samsung's advanced HBM4 packaging tech to secure supplies for its next-gen Rubin GPUs, reducing reliance on TSMC. This move ramps up production as AI demand surges and competition heats up with SK hynix.
Nvidia is conducting intensive audits of Samsung's HBM4 packaging at its Cheonan plant to ensure reliable supply for next-gen Rubin AI GPUs. This strategic move aims to diversify beyond TSMC as HBM4 mass production faces delays to late Q1 2026.
KLA Corporation's stock rose 3.8% ahead of its Investor Day, where it unveiled a $7 billion share repurchase program and a 21% quarterly dividend increase. The event highlighted the company's pivotal role in AI-driven semiconductor growth.
KLA Corporation's stock rose 3.8% amid anticipation for its March 12 Investor Day, where executives will unveil long-term financial targets and product strategies. The event, webcast live, comes after a turbulent week in semiconductors and has analysts optimistic about growth catalysts.
Nvidia is conducting rigorous audits of Samsung's HBM4 packaging technology to ensure reliable supply for its upcoming Rubin AI GPUs. This strategic move aims to diversify away from TSMC dependency amid exploding AI hardware demand.
Nvidia is rigorously auditing Samsung's HBM4 packaging technology for its next-gen Rubin AI GPUs, aiming to reduce reliance on TSMC amid booming AI demand. This step positions Samsung for mass production and bolsters Nvidia's supply stability.
LZE GmbH has launched the RFicient IC, bringing Fraunhofer's breakthrough ultra-low-power wake-up receiver technology to the commercial market for the first time as a standard product. The chip enables IoT devices to remain constantly connected while consuming less than 3.5 microamperes.
Nvidia is conducting intensive inspections of Samsung's HBM4 production lines as the memory chip race intensifies ahead of the Rubin GPU launch. The move reflects growing competition among memory makers and Nvidia's efforts to diversify its supply chain.